The addition of specific agents (peroxides, silanes) at low density polyethylene allows, under certain circumstances, crosslink the material resulting in the creation of a tridimensional structure with new connections between the long molecular chains. The SIOPLAS technology used for crosslinking was developed by Dow Corning and called SIOPLAS:
The process of crosslinking substantially improves the stability of the mechanical characteristics under temperature variation. The maximum working temperature goes to 90°C and under short-circuited to 250°C, increasing the resistance to abrasion, impact, cracking and chemical resistance. The crosslinking is also improve the performance at low temperatures, reducing the shrinkage of the material.